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| programmers:jtag-smt1:reference-manual [2023/02/09 00:28] – external edit 127.0.0.1 | programmers:jtag-smt1:reference-manual [2023/06/15 16:43] (current) – Baking time ammendment James Colvin | ||
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| ===== Mounting to Host PCBs ===== | ===== Mounting to Host PCBs ===== | ||
| - | The JTAG-SMT1 module has a moisture sensitivity level (MSL) of 6. Prior to reflow, the JTAG-SMT1 module must be dried by baking it at 125° C for 17 hours. Once this process has been completed, the module has a MSL of 3 and is suitable for reflow for up to 168 hours without additional drying. | + | The JTAG-SMT1 module has a moisture sensitivity level (MSL) of 6. Prior to reflow, the JTAG-SMT1 module must be dried by baking it at 70° C for 72 hours (the tray and the module itself can be baked 125° C for 24 hours, but any labels and rubber feet present on the module cannot withstand this higher temperature). Once this process has been completed, the module has a MSL of 3 and is suitable for reflow for up to 168 hours without additional drying. |
| SMT1 signal pads are finished with the ENIG process using 2u” gold over 150u” electroless nickel. The SMT1 is compatible with most mounting and reflow processes. The binding force of the solder is sufficient to hold the SMT1 firmly in place; no additional adhesives are required. | SMT1 signal pads are finished with the ENIG process using 2u” gold over 150u” electroless nickel. The SMT1 is compatible with most mounting and reflow processes. The binding force of the solder is sufficient to hold the SMT1 firmly in place; no additional adhesives are required. | ||